iFOX – wafer inspection system
Microelectronics processes are becoming denser, with more layers, and more complicated.
Mass production of WAFERS requires high-speed scanning systems capable of detecting defects on high-density printed layers.
Nextec’s advanced iFOX Wafer Inspection machine has been designed to fulfill the evolving market demands through the following capabilities:
- Scanning using advanced technology & precise mechanics for ultra-fast scanning with minimum aberration
- Advanced defect inspection technology using a Large-field 2D microscope with a superior illumination system & focus-on-the-fly technology
- Advanced 3D Bump inspection using patented 3D structure light microscope
Unlike our competitors, we provide a software package that is used to create measurement plans so that customers can build any measurement plan necessary.
PRODUCTS
iFox D
Defect inspection
iFox DM
For Defect inspection and Metrology
iFox DB
Defect and 3D Bump inspection
iFox DBM
For Defect, 3D Bump and Metrology
Defect inspection | 3D Bump Inspection | Metrology | |
iFox D | V | ||
iFox DB | V | V | |
iFox DM | V | V | |
iFox DBM | V | V | V |
2D Defects, 3D Dumps and Metrology
Defect detection
(down to 0.5 microns)
2D defects
Down to 0.5
3D BUMP measurement
3D bumps
300 to 5 microns height
300 to 5 microns height
NEW Metrology
Sub Pixel resolution
2D capabilities
- Defect finding down to 0.5 microns.
- Masks allow customers to choose different inspection parameters for different areas on the die.
- Advanced inspection algorithm to support large process variation.
- Fast algorithm implementation running on several GPUs boards and multiprocessing.
3D bump inspection capabilities
- Bump Height – using structure light technology for improved productivity and measurements accuracy.
- Inspection of millions of bumps at very high speed.
- Provides co-planarity data for each die and for all wafers.
Metrology capabilities
The metrology package provides a reach measurement tool library that creates a complicate metrology recipe in a seconds:
This results in a comprehensive inspection solution ofering the folowing: